LE25LB643TT by Onsemi | Memory ICs

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Manufacturer	Onsemi
Manufacturer's Part Number	LE25LB643TT
Description	EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Standby Current: .000002 Amp;
Datasheet	LE25LB643TT Datasheet
In Stock	1,725

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.000002 Amp
Organization:	8KX8
Sub-Category:	EEPROMs
Surface Mount:	YES
Maximum Supply Current:	3 mA
No. of Terminals:	8
No. of Words:	8192 words
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Write Protection:	HARDWARE/SOFTWARE
Technology:	CMOS
JESD-30 Code:	R-PDSO-G8
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Maximum Operating Temperature:	85 Cel
Endurance:	1000000 Write/Erase Cycles
Package Code:	TSSOP
Serial Bus Type:	SPI
Memory Density:	65536 bit
Memory IC Type:	EEPROM
Minimum Operating Temperature:	-40 Cel
Memory Width:	8
Qualification:	Not Qualified
Package Equivalence Code:	TSSOP8,.19
No. of Words Code:	8K
Minimum Data Retention Time:	20
Parallel or Serial:	SERIAL
Terminal Pitch:	.635 mm
Temperature Grade:	INDUSTRIAL
Power Supplies (V):	2/3.3

Pricing (USD)

Qty.	Unit Price	Ext. Price
1,725	-	-

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CIRCULAR CONN ACCESSORY; Shell Sizes: 8; 9; IEC Conformity: NO; MIL-Connector Accessory Name: BAND LOCK ADAPTER; MIL Conformity: YES; DIN Conformity: NO;

NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .6 A; JEDEC-95 Code: TO-92;

RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;

D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; IEC Conformity: NO; Mixed Contacts: NO; Empty Shell: NO;

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N-CHANNEL AND P-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 5 ohm; No. of Terminals: 3;

P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Moisture Sensitivity Level (MSL): 1;

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