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| Manufacturer | Onsemi |
|---|---|
| Manufacturer's Part Number | NCH-RSL10-101S51-ACG |
| Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 51; Package Code: LFBGA; Package Shape: RECTANGULAR; |
| Datasheet | NCH-RSL10-101S51-ACG Datasheet |
| In Stock | 2,594 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.25 V |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Seated Height: | 1.56 mm |
| Surface Mount: | YES |
| No. of Terminals: | 51 |
| Terminal Position: | UNSPECIFIED |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Data Rate: | 4 Mbps |
| JESD-30 Code: | R-PBGA-B51 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BUTT |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | LFBGA |
| Width: | 6 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Other Names: |
2156-NCH-RSL10-101S51-ACG NCH-RSL10-101S51-ACGOSDKR NCH-RSL10-101S51-ACGOSCT NCH-RSL10-101S51-ACGOSTR |
| Telecom IC Type: | TELECOM CIRCUIT |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Package Equivalence Code: | MODULE,51LEAD(UNSPEC) |
| Length: | 8 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .7 mm |
| Temperature Grade: | INDUSTRIAL |









