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Manufacturer | Onsemi |
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Manufacturer's Part Number | NCH-RSL10-101WC51-ABG |
Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 51; Package Code: VFBGA; Package Shape: RECTANGULAR; |
Datasheet | NCH-RSL10-101WC51-ABG Datasheet |
In Stock | 1,539 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.25 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | .381 mm |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER |
No. of Terminals: | 51 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Data Rate: | 2 Mbps |
JESD-30 Code: | R-PBGA-B51 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | VFBGA |
Width: | 2.325 mm |
Moisture Sensitivity Level (MSL): | 1 |
Telecom IC Type: | TELECOM CIRCUIT |
JESD-609 Code: | e2 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Package Equivalence Code: | BGA51,11X11,10 |
Length: | 2.364 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .252 mm |
Temperature Grade: | INDUSTRIAL |