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Manufacturer | Onsemi |
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Manufacturer's Part Number | NTHD2102PT1G |
Description | P-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2.1 W; Maximum Drain-Source On Resistance: .058 ohm; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; |
Datasheet | NTHD2102PT1G Datasheet |
In Stock | 276 |
NAME | DESCRIPTION |
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Package Body Material: | UNSPECIFIED |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Configuration: | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE |
Transistor Element Material: | SILICON |
Field Effect Transistor Technology: | METAL-OXIDE SEMICONDUCTOR |
Transistor Application: | SWITCHING |
Maximum Drain Current (ID): | 3.4 A |
Maximum Pulsed Drain Current (IDM): | 4.6 A |
Sub-Category: | Other Transistors |
Surface Mount: | YES |
Terminal Finish: | TIN |
No. of Terminals: | 8 |
Maximum Power Dissipation (Abs): | 2.1 W |
Terminal Position: | DUAL |
Package Style (Meter): | SMALL OUTLINE |
JESD-30 Code: | R-XDSO-C8 |
No. of Elements: | 2 |
Package Shape: | RECTANGULAR |
Terminal Form: | C BEND |
Operating Mode: | ENHANCEMENT MODE |
Maximum Drain-Source On Resistance: | .058 ohm |
Moisture Sensitivity Level (MSL): | 1 |
Polarity or Channel Type: | P-CHANNEL |
JESD-609 Code: | e3 |
Minimum DS Breakdown Voltage: | 8 V |
Qualification: | Not Qualified |
Maximum Drain Current (Abs) (ID): | 3.4 A |
Peak Reflow Temperature (C): | 260 |