
Image shown is a representation only.
Manufacturer | Philips Semiconductors |
---|---|
Manufacturer's Part Number | 74LVC1G66GW |
Description | SPST; Temperature Grade: INDUSTRIAL; No. of Terminals: 5; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES; |
Datasheet | 74LVC1G66GW Datasheet |
In Stock | 308 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Sub-Category: | Multiplexer or Switches |
Surface Mount: | YES |
Terminal Finish: | MATTE TIN |
No. of Terminals: | 5 |
Maximum On-state Resistance (Ron): | 100 ohm |
Terminal Position: | DUAL |
Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Technology: | CMOS |
JESD-30 Code: | R-PDSO-G5 |
Package Shape: | RECTANGULAR |
Terminal Form: | GULL WING |
Maximum Operating Temperature: | 85 Cel |
Package Code: | TSSOP |
Switching (V): | MAKE-BEFORE-BREAK |
Normal Position (V): | NO |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | TSSOP5/6,.08 |
Other IC type: | SPST |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .635 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 1.8/5 |