Image shown is a representation only.
| Manufacturer | Phoenix Contact |
|---|---|
| Manufacturer's Part Number | 2988146 |
| Description | MEMORY CIRCUIT; Package Code: DIE; Package Shape: RECTANGULAR; Memory Density: 4294967296 bit; No. of Words Code: 512M; Surface Mount: YES; |
| Datasheet | 2988146 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Memory Density: | 4294967296 bit |
| Organization: | 512MX8 |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Surface Mount: | YES |
| Memory IC Type: | MEMORY CIRCUIT |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| No. of Words: | 536870912 words |
| Terminal Position: | UPPER |
| Package Style (Meter): | UNCASED CHIP |
| Technology: | CMOS |
| No. of Words Code: | 512M |
| JESD-30 Code: | R-XUUC-N |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Operating Mode: | ASYNCHRONOUS |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Package Code: | DIE |
