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| Manufacturer | Qualcomm |
|---|---|
| Manufacturer's Part Number | APQ-8016E-1-760NSP-TR-01-0 |
| Description | MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 760; Package Code: VFBGA; Package Shape: RECTANGULAR; |
| Datasheet | APQ-8016E-1-760NSP-TR-01-0 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .84 V |
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | MICROPROCESSOR, RISC |
| Maximum Supply Voltage: | 1.12 V |
| Maximum Seated Height: | .96 mm |
| Surface Mount: | YES |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -30 Cel |
| No. of Terminals: | 760 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Length: | 14 mm |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B760 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 60 Cel |
| Peak Reflow Temperature (C): | 255 |
| Package Code: | VFBGA |
| Width: | 12 mm |
| Temperature Grade: | OTHER |
| Moisture Sensitivity Level (MSL): | 3 |









