Qualcomm - APQ-8016E-1-760NSP-TR-01-0

APQ-8016E-1-760NSP-TR-01-0 by Qualcomm

Image shown is a representation only.

Manufacturer Qualcomm
Manufacturer's Part Number APQ-8016E-1-760NSP-TR-01-0
Description MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 760; Package Code: VFBGA; Package Shape: RECTANGULAR;
Datasheet APQ-8016E-1-760NSP-TR-01-0 Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: .84 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.12 V
Maximum Seated Height: .96 mm
Surface Mount: YES
JESD-609 Code: e1
Minimum Operating Temperature: -30 Cel
No. of Terminals: 760
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Length: 14 mm
Technology: CMOS
JESD-30 Code: R-PBGA-B760
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 60 Cel
Peak Reflow Temperature (C): 255
Package Code: VFBGA
Width: 12 mm
Temperature Grade: OTHER
Moisture Sensitivity Level (MSL): 3
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products