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Manufacturer | Qualcomm |
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Manufacturer's Part Number | APQ-8016E-1-760NSP-TR-01-0 |
Description | MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 760; Package Code: VFBGA; Package Shape: RECTANGULAR; |
Datasheet | APQ-8016E-1-760NSP-TR-01-0 Datasheet |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .84 V |
Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 1.12 V |
Maximum Seated Height: | .96 mm |
Surface Mount: | YES |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -30 Cel |
No. of Terminals: | 760 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Length: | 14 mm |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B760 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 60 Cel |
Peak Reflow Temperature (C): | 255 |
Package Code: | VFBGA |
Width: | 12 mm |
Temperature Grade: | OTHER |
Moisture Sensitivity Level (MSL): | 3 |