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| Manufacturer | Qualcomm |
|---|---|
| Manufacturer's Part Number | BC57G687C-ANN-E4 |
| Description | TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 105; Package Code: LFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH; |
| Datasheet | BC57G687C-ANN-E4 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.5 V |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | 1.6 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 105 |
| Package Equivalence Code: | BGA105,11X11,32 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Data Rate: | 12 Mbps |
| Screening Level: | AEC-Q100 |
| Length: | 10 mm |
| JESD-30 Code: | S-PBGA-B105 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | LFBGA |
| Width: | 10 mm |
| Terminal Pitch: | .8 mm |
