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| Manufacturer | Qualcomm |
|---|---|
| Manufacturer's Part Number | PM-8916-0-176NSP-TR-02-1-01 |
| Description | TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 176; Package Code: VFBGA; Package Shape: SQUARE; Maximum Seated Height: .86 mm; |
| Datasheet | PM-8916-0-176NSP-TR-02-1-01 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.6 V |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | .86 mm |
| Surface Mount: | YES |
| No. of Functions: | 1 |
| No. of Terminals: | 176 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Length: | 6.2 mm |
| Technology: | HVCMOS |
| JESD-30 Code: | S-PBGA-B176 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Package Code: | VFBGA |
| Width: | 6.2 mm |
| Terminal Pitch: | .4 mm |
| Moisture Sensitivity Level (MSL): | 3 |
