
Image shown is a representation only.
Manufacturer | Renesas Electronics |
---|---|
Manufacturer's Part Number | 5962-01-106-4166 |
Description | BUFFER; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; |
Datasheet | 5962-01-106-4166 Datasheet |
NAME | DESCRIPTION |
---|---|
Package Body Material: | CERAMIC |
Schmitt Trigger: | NO |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Sub-Category: | Gates |
Surface Mount: | YES |
No. of Terminals: | 16 |
Maximum I (ol): | 1.8 Amp |
Terminal Position: | DUAL |
Package Style (Meter): | FLATPACK |
Screening Level: | 38535Q/M;38534H;883B |
Technology: | CMOS |
JESD-30 Code: | R-XDFP-F16 |
Package Shape: | RECTANGULAR |
Terminal Form: | FLAT |
Maximum Operating Temperature: | 125 Cel |
Package Code: | DFP |
Propagation Delay At Nominal Supply: | 140 ns |
Load Capacitance (CL): | 50 pF |
Logic IC Type: | BUFFER |
Minimum Operating Temperature: | -55 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | FL16,.3 |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Terminal Pitch: | 1.27 mm |
Temperature Grade: | MILITARY |
Power Supplies (V): | 5/15 |