70P257L55BYI by Renesas Electronics | Memory ICs

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Manufacturer	Renesas Electronics
Manufacturer's Part Number	70P257L55BYI
Description	MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
Datasheet	70P257L55BYI Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.000008 Amp
Organization:	8KX16
Output Characteristics:	3-STATE
Maximum Time At Peak Reflow Temperature (s):	30
Minimum Supply Voltage (Vsup):	1.7 V
Sub-Category:	SRAMs
Surface Mount:	YES
Maximum Supply Current:	25 mA
Terminal Finish:	TIN LEAD
No. of Terminals:	100
No. of Words:	8192 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	S-PBGA-B100
Package Shape:	SQUARE
Terminal Form:	BALL
Operating Mode:	ASYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	BGA
Moisture Sensitivity Level (MSL):	3
Input/Output Type:	COMMON
No. of Ports:	2
Memory Density:	131072 bit
Minimum Standby Voltage:	1.7 V
Memory IC Type:	MULTI-PORT SRAM
JESD-609 Code:	e0
Minimum Operating Temperature:	-40 Cel
Memory Width:	16
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	BGA100,10X10,20
Maximum Access Time:	55 ns
No. of Words Code:	8K
Nominal Supply Voltage / Vsup (V):	1.8
Peak Reflow Temperature (C):	225
Parallel or Serial:	PARALLEL
Terminal Pitch:	.5 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	1.9 V
Power Supplies (V):	1.8

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