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| Manufacturer | Renesas Electronics |
|---|---|
| Manufacturer's Part Number | 70T3319S166BCGI8 |
| Description | APPLICATION SPECIFIC SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Memory Width: 18; |
| Datasheet | 70T3319S166BCGI8 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .02 Amp |
| Organization: | 128KX18 |
| Output Characteristics: | 3-STATE |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Minimum Supply Voltage (Vsup): | 2.4 V |
| Sub-Category: | SRAMs |
| Surface Mount: | YES |
| Maximum Supply Current: | 510 mA |
| Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
| No. of Terminals: | 256 |
| Maximum Clock Frequency (fCLK): | 166 MHz |
| No. of Words: | 131072 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B256 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | BGA |
| Moisture Sensitivity Level (MSL): | 3 |
| Input/Output Type: | COMMON |
| No. of Ports: | 2 |
| Memory Density: | 2359296 bit |
| Minimum Standby Voltage: | 2.4 V |
| Memory IC Type: | APPLICATION SPECIFIC SRAM |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 18 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA256,16X16,40 |
| Maximum Access Time: | 3.6 ns |
| No. of Words Code: | 128K |
| Nominal Supply Voltage / Vsup (V): | 2.5 |
| Peak Reflow Temperature (C): | 260 |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 2.6 V |
| Power Supplies (V): | 2.5,2.5/3.3 |
