70T3509M133BPG by Renesas Electronics | Memory ICs

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Manufacturer	Renesas Electronics
Manufacturer's Part Number	70T3509M133BPG
Description	MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
Datasheet	70T3509M133BPG Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.06 Amp
Organization:	1MX36
Output Characteristics:	3-STATE
Sub-Category:	SRAMs
Surface Mount:	YES
Maximum Supply Current:	1120 mA
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	256
Maximum Clock Frequency (fCLK):	133 MHz
No. of Words:	1048576 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	S-PBGA-B256
Package Shape:	SQUARE
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	BGA
Moisture Sensitivity Level (MSL):	3
Input/Output Type:	COMMON
No. of Ports:	2
Memory Density:	37748736 bit
Minimum Standby Voltage:	2.4 V
Memory IC Type:	MULTI-PORT SRAM
JESD-609 Code:	e1
Minimum Operating Temperature:	0 Cel
Memory Width:	36
Qualification:	Not Qualified
Package Equivalence Code:	BGA256,16X16,40
Maximum Access Time:	4.2 ns
No. of Words Code:	1M
Parallel or Serial:	PARALLEL
Terminal Pitch:	1 mm
Temperature Grade:	COMMERCIAL
Power Supplies (V):	2.5/3.3

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