Renesas Electronics - 70T3509MS133BPG8

70T3509MS133BPG8 by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number 70T3509MS133BPG8
Description MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: BGA; Package Shape: UNSPECIFIED; No. of Functions: 1;
Datasheet 70T3509MS133BPG8 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 1MX36
Minimum Supply Voltage (Vsup): 2.4 V
Surface Mount: YES
No. of Terminals: 256
No. of Words: 1048576 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: X-PBGA-B256
Package Shape: UNSPECIFIED
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Memory Density: 37748736 bit
Memory IC Type: MULTI-PORT SRAM
Minimum Operating Temperature: 0 Cel
Memory Width: 36
No. of Functions: 1
Maximum Access Time: 4.2 ns
No. of Words Code: 1M
Nominal Supply Voltage / Vsup (V): 2.5
Parallel or Serial: PARALLEL
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 2.6 V
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