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Manufacturer | Renesas Electronics |
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Manufacturer's Part Number | 70T3589S166BFGI8 |
Description | MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 208; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B208; |
Datasheet | 70T3589S166BFGI8 Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Standby Current: | .02 Amp |
Organization: | 64KX36 |
Output Characteristics: | 3-STATE |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Sub-Category: | SRAMs |
Surface Mount: | YES |
Maximum Supply Current: | 510 mA |
Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
No. of Terminals: | 208 |
Maximum Clock Frequency (fCLK): | 166 MHz |
No. of Words: | 65536 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B208 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Package Code: | FBGA |
Moisture Sensitivity Level (MSL): | 3 |
Input/Output Type: | COMMON |
No. of Ports: | 2 |
Memory Density: | 2359296 bit |
Minimum Standby Voltage: | 2.4 V |
Memory IC Type: | MULTI-PORT SRAM |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 36 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA208,17X17,32 |
Maximum Access Time: | 12 ns |
No. of Words Code: | 64K |
Peak Reflow Temperature (C): | 260 |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 2.5,2.5/3.3 |