Renesas Electronics - 70V7319S133BCG

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70V7319S133BCG by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number 70V7319S133BCG
Description MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; No. of Words: 262144 words;
Datasheet 70V7319S133BCG Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 256KX18
Minimum Supply Voltage (Vsup): 3.15 V
Surface Mount: YES
No. of Terminals: 256
No. of Words: 262144 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B256
Package Shape: SQUARE
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Memory Density: 4718592 bit
Memory IC Type: MULTI-PORT SRAM
Minimum Operating Temperature: 0 Cel
Memory Width: 18
No. of Functions: 1
Maximum Access Time: 4.2 ns
No. of Words Code: 256K
Nominal Supply Voltage / Vsup (V): 3.3
Additional Features: FLOW-THROUGH OR PIPELINED ARCHITECTURE
Parallel or Serial: PARALLEL
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 3.45 V
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