Renesas Electronics - 70V7319S166BCG1

70V7319S166BCG1 by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number 70V7319S166BCG1
Description MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Maximum Seated Height: 1.4 mm;
Datasheet 70V7319S166BCG1 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 256KX18
Maximum Seated Height: 1.4 mm
Minimum Supply Voltage (Vsup): 3.15 V
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 256
No. of Words: 262144 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE
Technology: CMOS
JESD-30 Code: S-PBGA-B256
Package Shape: SQUARE
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: LBGA
Width: 17 mm
Moisture Sensitivity Level (MSL): 3
Memory Density: 4718592 bit
Memory IC Type: MULTI-PORT SRAM
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Memory Width: 18
No. of Functions: 1
Length: 17 mm
Maximum Access Time: 3.6 ns
No. of Words Code: 256K
Nominal Supply Voltage / Vsup (V): 3.3
Parallel or Serial: SERIAL
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 3.45 V
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