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Manufacturer | Renesas Electronics |
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Manufacturer's Part Number | 70V7319S200DDI |
Description | MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Additional Features: FLOW-THROUGH OR PIPELINED ARCHITECTURE; |
Datasheet | 70V7319S200DDI Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 256KX18 |
Maximum Seated Height: | 1.6 mm |
Minimum Supply Voltage (Vsup): | 3.15 V |
Surface Mount: | YES |
Terminal Finish: | TIN LEAD |
No. of Terminals: | 144 |
No. of Words: | 262144 words |
Terminal Position: | QUAD |
Package Style (Meter): | FLATPACK, LOW PROFILE, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | S-PQFP-G144 |
Package Shape: | SQUARE |
Terminal Form: | GULL WING |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Package Code: | LFQFP |
Width: | 20 mm |
Moisture Sensitivity Level (MSL): | 4 |
Memory Density: | 4718592 bit |
Memory IC Type: | MULTI-PORT SRAM |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 18 |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Length: | 20 mm |
Maximum Access Time: | 10 ns |
No. of Words Code: | 256K |
Nominal Supply Voltage / Vsup (V): | 3.3 |
Additional Features: | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | .5 mm |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 3.45 V |