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| Manufacturer | Renesas Electronics |
|---|---|
| Manufacturer's Part Number | 70V7339S133BFGI8 |
| Description | MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 208; Package Code: LFBGA; Package Shape: SQUARE; Parallel or Serial: SERIAL; |
| Datasheet | 70V7339S133BFGI8 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 512KX18 |
| Maximum Seated Height: | 1.4 mm |
| Minimum Supply Voltage (Vsup): | 3.15 V |
| Surface Mount: | YES |
| No. of Terminals: | 208 |
| No. of Words: | 524288 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B208 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | LFBGA |
| Width: | 15 mm |
| Memory Density: | 9437184 bit |
| Memory IC Type: | MULTI-PORT SRAM |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 18 |
| No. of Functions: | 1 |
| Length: | 15 mm |
| Maximum Access Time: | 4.2 ns |
| No. of Words Code: | 512K |
| Nominal Supply Voltage / Vsup (V): | 3.3 |
| Additional Features: | PIPELINED ARCHITECTURE OR FLOW-THROUGH |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3.45 V |
