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Manufacturer | Renesas Electronics |
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Manufacturer's Part Number | 70V7519S166BFG |
Description | MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 208; Package Code: BGA; Package Shape: SQUARE; Technology: CMOS; |
Datasheet | 70V7519S166BFG Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 256KX36 |
Minimum Supply Voltage (Vsup): | 3.15 V |
Surface Mount: | YES |
No. of Terminals: | 208 |
No. of Words: | 262144 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B208 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 70 Cel |
Package Code: | BGA |
Memory Density: | 9437184 bit |
Memory IC Type: | MULTI-PORT SRAM |
Minimum Operating Temperature: | 0 Cel |
Memory Width: | 36 |
No. of Functions: | 1 |
Maximum Access Time: | 3.6 ns |
No. of Words Code: | 256K |
Nominal Supply Voltage / Vsup (V): | 3.3 |
Additional Features: | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
Parallel or Serial: | PARALLEL |
Temperature Grade: | COMMERCIAL |
Maximum Supply Voltage (Vsup): | 3.45 V |