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| Manufacturer | Renesas Electronics |
|---|---|
| Manufacturer's Part Number | 70V7519S200BCG |
| Description | DUAL-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 3.45 V; |
| Datasheet | 70V7519S200BCG Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 256KX36 |
| Minimum Supply Voltage (Vsup): | 3.15 V |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 256 |
| No. of Words: | 262144 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B256 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | BGA |
| Moisture Sensitivity Level (MSL): | 3 |
| Memory Density: | 9437184 bit |
| Memory IC Type: | DUAL-PORT SRAM |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 36 |
| No. of Functions: | 1 |
| Maximum Access Time: | 3.4 ns |
| No. of Words Code: | 256K |
| Nominal Supply Voltage / Vsup (V): | 3.3 |
| Additional Features: | PIPELINED OR FLOW THROUGH ARCHITECTURE |
| Peak Reflow Temperature (C): | 260 |
| Parallel or Serial: | PARALLEL |
| Temperature Grade: | COMMERCIAL |
| Maximum Supply Voltage (Vsup): | 3.45 V |
