71V016HSA10BFG by Renesas Electronics | Memory ICs

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Manufacturer	Renesas Electronics
Manufacturer's Part Number	71V016HSA10BFG
Description	STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: FBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, FINE PITCH;
Datasheet	71V016HSA10BFG Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.01 Amp
Organization:	64KX16
Output Characteristics:	3-STATE
Sub-Category:	SRAMs
Surface Mount:	YES
Maximum Supply Current:	160 mA
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	48
No. of Words:	65536 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B48
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	ASYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	FBGA
Moisture Sensitivity Level (MSL):	3
Input/Output Type:	COMMON
Memory Density:	1048576 bit
Minimum Standby Voltage:	3.15 V
Memory IC Type:	STANDARD SRAM
JESD-609 Code:	e1
Minimum Operating Temperature:	0 Cel
Memory Width:	16
Qualification:	Not Qualified
Package Equivalence Code:	BGA48,6X8,30
Maximum Access Time:	10 ns
No. of Words Code:	64K
Nominal Supply Voltage / Vsup (V):	3.3
Parallel or Serial:	PARALLEL
Terminal Pitch:	.75 mm
Temperature Grade:	COMMERCIAL
Power Supplies (V):	3.3

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