71V2556SA166BG by Renesas Electronics | Memory ICs

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Manufacturer	Renesas Electronics
Manufacturer's Part Number	71V2556SA166BG
Description	ZBT SRAM; No. of Terminals: 119; Package Code: BGA; Package Shape: RECTANGULAR; Memory Density: 4718592 bit; JESD-609 Code: e0;
Datasheet	71V2556SA166BG Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.04 Amp
Organization:	128KX36
Output Characteristics:	3-STATE
Maximum Time At Peak Reflow Temperature (s):	20
Maximum Seated Height:	2.36 mm
Minimum Supply Voltage (Vsup):	3.135 V
Surface Mount:	YES
Maximum Supply Current:	350 mA
Terminal Finish:	TIN LEAD
No. of Terminals:	119
Maximum Clock Frequency (fCLK):	166 MHz
No. of Words:	131072 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	R-PBGA-B119
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	BGA
Width:	14 mm
Moisture Sensitivity Level (MSL):	3
Input/Output Type:	COMMON
Memory Density:	4718592 bit
Minimum Standby Voltage:	3.14 V
Memory IC Type:	ZBT SRAM
JESD-609 Code:	e0
Minimum Operating Temperature:	0 Cel
Memory Width:	36
No. of Functions:	1
Package Equivalence Code:	BGA119,7X17,50
Length:	22 mm
Maximum Access Time:	3.5 ns
No. of Words Code:	128K
Nominal Supply Voltage / Vsup (V):	3.3
Additional Features:	PIPELINED ARCHITECTURE
Peak Reflow Temperature (C):	225
Parallel or Serial:	PARALLEL
Terminal Pitch:	1.27 mm
Maximum Supply Voltage (Vsup):	3.465 V

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