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| Manufacturer | Renesas Electronics |
|---|---|
| Manufacturer's Part Number | 71V35781183BQI |
| Description | CACHE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 165; Package Code: TBGA; Package Shape: RECTANGULAR; JESD-609 Code: e0; |
| Datasheet | 71V35781183BQI Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .035 Amp |
| Organization: | 256KX18 |
| Output Characteristics: | 3-STATE |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1.2 mm |
| Minimum Supply Voltage (Vsup): | 3.135 V |
| Sub-Category: | SRAMs |
| Surface Mount: | YES |
| Maximum Supply Current: | 350 mA |
| Terminal Finish: | TIN LEAD |
| No. of Terminals: | 165 |
| Maximum Clock Frequency (fCLK): | 183 MHz |
| No. of Words: | 262144 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B165 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | TBGA |
| Width: | 13 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Input/Output Type: | COMMON |
| Memory Density: | 4718592 bit |
| Minimum Standby Voltage: | 3.14 V |
| Memory IC Type: | CACHE SRAM |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 18 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA165,11X15,40 |
| Length: | 15 mm |
| Maximum Access Time: | 3.3 ns |
| No. of Words Code: | 256K |
| Nominal Supply Voltage / Vsup (V): | 3.3 |
| Additional Features: | PIPELINED ARCHITECTURE |
| Peak Reflow Temperature (C): | 225 |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3.465 V |
| Power Supplies (V): | 3.3 |
