Renesas Electronics - 7201LA30TDGB

7201LA30TDGB by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number 7201LA30TDGB
Description BI-DIRECTIONAL FIFO; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
Datasheet 7201LA30TDGB Datasheet
NAME DESCRIPTION
Package Body Material: CERAMIC
Maximum Standby Current: .015 Amp
Organization: 512X9
Sub-Category: FIFOs
Surface Mount: NO
Maximum Supply Current: 100 mA
Cycle Time: 40 ns
Terminal Finish: MATTE TIN
No. of Terminals: 28
Maximum Clock Frequency (fCLK): 25 MHz
No. of Words: 512 words
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: CMOS
JESD-30 Code: R-XDIP-T28
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 125 Cel
Package Code: DIP
Memory Density: 4608 bit
Memory IC Type: BI-DIRECTIONAL FIFO
JESD-609 Code: e3
Minimum Operating Temperature: -55 Cel
Memory Width: 9
Qualification: Not Qualified
Package Equivalence Code: DIP28,.3
Maximum Access Time: 30 ns
No. of Words Code: 512
Nominal Supply Voltage / Vsup (V): 5
Parallel or Serial: PARALLEL
Terminal Pitch: 2.54 mm
Temperature Grade: MILITARY
Power Supplies (V): 5
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