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| Manufacturer | Renesas Electronics |
|---|---|
| Manufacturer's Part Number | 72T7295L4-4BB |
| Description | OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE; Memory Density: 2359296 bit; |
| Datasheet | 72T7295L4-4BB Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .05 Amp |
| Organization: | 32KX72 |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1.97 mm |
| Minimum Supply Voltage (Vsup): | 2.375 V |
| Sub-Category: | FIFOs |
| Surface Mount: | YES |
| Maximum Supply Current: | 60 mA |
| Cycle Time: | 4.44 ns |
| Terminal Finish: | Tin/Lead (Sn63Pb37) |
| No. of Terminals: | 324 |
| Maximum Clock Frequency (fCLK): | 225 MHz |
| No. of Words: | 32768 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B324 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | BGA |
| Width: | 19 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Memory Density: | 2359296 bit |
| Memory IC Type: | OTHER FIFO |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 72 |
| Output Enable: | YES |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA324,18X18,40 |
| Length: | 19 mm |
| Maximum Access Time: | 3.4 ns |
| No. of Words Code: | 32K |
| Nominal Supply Voltage / Vsup (V): | 2.5 |
| Additional Features: | ASYNCHRONOUS OPERATION ALSO POSSIBLE |
| Peak Reflow Temperature (C): | 225 |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | COMMERCIAL |
| Maximum Supply Voltage (Vsup): | 2.625 V |
| Power Supplies (V): | 2.5 |









