Image shown is a representation only.
| Manufacturer | Renesas Electronics |
|---|---|
| Manufacturer's Part Number | 72V51443L6BB8 |
| Description | OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Terminal Finish: TIN LEAD; |
| Datasheet | 72V51443L6BB8 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .01 Amp |
| Organization: | 64KX18 |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Sub-Category: | FIFOs |
| Surface Mount: | YES |
| Maximum Supply Current: | 100 mA |
| Terminal Finish: | TIN LEAD |
| No. of Terminals: | 256 |
| Maximum Clock Frequency (fCLK): | 166 MHz |
| No. of Words: | 65536 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B256 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | BGA |
| Moisture Sensitivity Level (MSL): | 3 |
| Memory Density: | 1179648 bit |
| Memory IC Type: | OTHER FIFO |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 18 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA256,16X16,40 |
| Alternate Memory Width: | 9 |
| Maximum Access Time: | 3.7 ns |
| No. of Words Code: | 64K |
| Nominal Supply Voltage / Vsup (V): | 3.3 |
| Peak Reflow Temperature (C): | 225 |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | COMMERCIAL |
| Power Supplies (V): | 3.3 |
