Renesas Electronics - 74SSTU32864DBFG

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74SSTU32864DBFG by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number 74SSTU32864DBFG
Description D FLIP-FLOP; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; Packing Method: TRAY; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3;
Datasheet 74SSTU32864DBFG Datasheet
NAME DESCRIPTION
Packing Method: TRAY
Peak Reflow Temperature (C): 260
Logic IC Type: D FLIP-FLOP
Terminal Finish: TIN SILVER COPPER
JESD-609 Code: e1
Moisture Sensitivity Level (MSL): 3
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