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| Manufacturer | Renesas Electronics |
|---|---|
| Manufacturer's Part Number | 74SSTUBF32869ABKG |
| Description | D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 150; Package Code: TFBGA; Package Shape: RECTANGULAR; |
| Datasheet | 74SSTUBF32869ABKG Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1.2 mm |
| Trigger Type: | POSITIVE EDGE |
| Minimum Supply Voltage (Vsup): | 1.7 V |
| Sub-Category: | Other Logic ICs |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 150 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B150 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Minimum fmax: | 340 MHz |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | TFBGA |
| Width: | 8 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| No. of Bits: | 14 |
| Output Polarity: | TRUE |
| Packing Method: | TRAY |
| Logic IC Type: | D FLIP-FLOP |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | 0 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA150,11X19,25 |
| Length: | 13 mm |
| Propagation Delay (tpd): | 1.5 ns |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Family: | SSTU |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .65 mm |
| Temperature Grade: | COMMERCIAL |
| Maximum Supply Voltage (Vsup): | 1.9 V |
| Power Supplies (V): | 1.8 |
