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Manufacturer | Renesas Electronics |
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Manufacturer's Part Number | 80HCPS1848HMI |
Description | TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 4; |
Datasheet | 80HCPS1848HMI Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Telecom IC Type: | TELECOM CIRCUIT |
Maximum Seated Height: | 2.83 mm |
Surface Mount: | YES |
Terminal Finish: | Tin/Lead (Sn/Pb) |
JESD-609 Code: | e0 |
No. of Functions: | 1 |
No. of Terminals: | 784 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Length: | 29 mm |
JESD-30 Code: | S-PBGA-B784 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Peak Reflow Temperature (C): | 225 |
Package Code: | BGA |
Width: | 29 mm |
Terminal Pitch: | 1 mm |
Moisture Sensitivity Level (MSL): | 4 |