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| Manufacturer | Renesas Electronics |
|---|---|
| Manufacturer's Part Number | 89HPES8T5ZHBCG |
| Description | BUS CONTROLLER, PCI; Terminal Form: BALL; No. of Terminals: 324; Package Code: LBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V; |
| Datasheet | 89HPES8T5ZHBCG Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .9 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1 V |
| Maximum Seated Height: | 1.5 mm |
| Surface Mount: | YES |
| Maximum Supply Current: | 792 mA |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 324 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE |
| Maximum Data Transfer Rate: | 312.5 MBps |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B324 |
| Maximum Clock Frequency: | 125 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | LBGA |
| Width: | 19 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Peripheral IC Type: | BUS CONTROLLER, PCI |
| Maximum Supply Voltage: | 1.1 V |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | 0 Cel |
| Package Equivalence Code: | BGA324,18X18,40 |
| Length: | 19 mm |
| Peak Reflow Temperature (C): | 260 |
| Bus Compatibility: | PCI; SMBUS |
| Terminal Pitch: | 1 mm |









