Renesas Electronics - 89TSF553BL

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89TSF553BL by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number 89TSF553BL
Description MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 960; Package Code: BGA; Package Shape: SQUARE;
Datasheet 89TSF553BL Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 1.71 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: 1.8 V
Maximum Supply Voltage: 1.89 V
Maximum Seated Height: 3.29 mm
Surface Mount: YES
Terminal Finish: TIN LEAD
JESD-609 Code: e0
Minimum Operating Temperature: 0 Cel
No. of Terminals: 960
Qualification: Not Qualified
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Length: 35 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B960
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Width: 35 mm
Temperature Grade: OTHER
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