HB66A2568A-25 by Renesas Electronics | Memory ICs

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Manufacturer	Renesas Electronics
Manufacturer's Part Number	HB66A2568A-25
Description	SRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 60; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE; No. of Functions: 1;
Datasheet	HB66A2568A-25 Datasheet

NAME	DESCRIPTION
Package Body Material:	UNSPECIFIED
Organization:	256KX8
Maximum Seated Height:	13.34 mm
Minimum Supply Voltage (Vsup):	4.5 V
Surface Mount:	NO
No. of Terminals:	60
No. of Words:	262144 words
Terminal Position:	ZIG-ZAG
Package Style (Meter):	MICROELECTRONIC ASSEMBLY
Technology:	CMOS
JESD-30 Code:	R-XZMA-T60
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Operating Mode:	ASYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Memory Density:	2097152 bit
Memory IC Type:	SRAM MODULE
Minimum Operating Temperature:	0 Cel
Memory Width:	8
No. of Functions:	1
Qualification:	Not Qualified
Length:	87.63 mm
Maximum Access Time:	25 ns
No. of Words Code:	256K
Nominal Supply Voltage / Vsup (V):	5
Parallel or Serial:	PARALLEL
Terminal Pitch:	2.54 mm
Temperature Grade:	COMMERCIAL
Maximum Supply Voltage (Vsup):	5.5 V

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