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Manufacturer | Renesas Electronics |
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Manufacturer's Part Number | HD6417751BP167V |
Description | MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | HD6417751BP167V Datasheet |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.6 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.8 V |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | 2.5 mm |
Surface Mount: | YES |
No. of Terminals: | 256 |
Terminal Position: | BOTTOM |
Format: | FLOATING POINT |
Package Style (Meter): | GRID ARRAY |
Address Bus Width: | 26 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B256 |
Maximum Clock Frequency: | 56 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 75 Cel |
Package Code: | BGA |
Width: | 27 mm |
Speed: | 167 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 2 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 32 |
Bit Size: | 32 |
Minimum Operating Temperature: | -20 Cel |
Length: | 27 mm |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Terminal Pitch: | 1.27 mm |
Temperature Grade: | COMMERCIAL EXTENDED |