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Manufacturer | Renesas Electronics |
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Manufacturer's Part Number | HD6417760BP200AD |
Description | MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | HD6417760BP200AD Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Speed: | 200 rpm |
Peripheral IC Type: | MICROCONTROLLER, RISC |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Sub-Category: | Microprocessors |
Surface Mount: | YES |
Bit Size: | 32 |
Maximum Supply Current: | 730 mA |
Minimum Operating Temperature: | -40 Cel |
No. of Terminals: | 256 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA256,20X20,40 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B256 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Package Code: | BGA |
Terminal Pitch: | 1 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 1.5,3.3 |