Renesas Electronics - HD64F2238RBR13

HD64F2238RBR13 by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number HD64F2238RBR13
Description MICROCONTROLLER; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: BALL; No. of Terminals: 112; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet HD64F2238RBR13 Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 2.7 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3 V
Maximum Seated Height: 1.4 mm
Sub-Category: Microcontrollers
Surface Mount: YES
ADC Channels: YES
No. of Terminals: 112
DMA Channels: YES
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
No. of I/O Lines: 82
Address Bus Width: 24
Technology: CMOS
JESD-30 Code: S-PBGA-B112
Maximum Clock Frequency: 13.5 MHz
Package Shape: SQUARE
ROM Words: 262144
Terminal Form: BALL
Maximum Operating Temperature: 75 Cel
Package Code: LFBGA
Width: 10 mm
Moisture Sensitivity Level (MSL): 1
Speed: 13.5 rpm
Peripheral IC Type: MICROCONTROLLER
Maximum Supply Voltage: 3.6 V
RAM Bytes: 16384
External Data Bus Width: 16
Bit Size: 16
DAC Channels: YES
Minimum Operating Temperature: -20 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA112,11X11,32
Length: 10 mm
PWM Channels: YES
Additional Features: OPERATES AT 2.2V MINIMUM SUPPLY @ 6.25MHZ
ROM Programmability: FLASH
Terminal Pitch: .8 mm
Temperature Grade: COMMERCIAL EXTENDED
Power Supplies (V): 3/3.3
CPU Family: H8S/2000
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