
Image shown is a representation only.
Manufacturer | Renesas Electronics |
---|---|
Manufacturer's Part Number | HD64F2238RBR13 |
Description | MICROCONTROLLER; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: BALL; No. of Terminals: 112; Package Code: LFBGA; Package Shape: SQUARE; |
Datasheet | HD64F2238RBR13 Datasheet |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 2.7 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 3 V |
Maximum Seated Height: | 1.4 mm |
Sub-Category: | Microcontrollers |
Surface Mount: | YES |
ADC Channels: | YES |
No. of Terminals: | 112 |
DMA Channels: | YES |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
No. of I/O Lines: | 82 |
Address Bus Width: | 24 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B112 |
Maximum Clock Frequency: | 13.5 MHz |
Package Shape: | SQUARE |
ROM Words: | 262144 |
Terminal Form: | BALL |
Maximum Operating Temperature: | 75 Cel |
Package Code: | LFBGA |
Width: | 10 mm |
Moisture Sensitivity Level (MSL): | 1 |
Speed: | 13.5 rpm |
Peripheral IC Type: | MICROCONTROLLER |
Maximum Supply Voltage: | 3.6 V |
RAM Bytes: | 16384 |
External Data Bus Width: | 16 |
Bit Size: | 16 |
DAC Channels: | YES |
Minimum Operating Temperature: | -20 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA112,11X11,32 |
Length: | 10 mm |
PWM Channels: | YES |
Additional Features: | OPERATES AT 2.2V MINIMUM SUPPLY @ 6.25MHZ |
ROM Programmability: | FLASH |
Terminal Pitch: | .8 mm |
Temperature Grade: | COMMERCIAL EXTENDED |
Power Supplies (V): | 3/3.3 |
CPU Family: | H8S/2000 |