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| Manufacturer | Renesas Electronics |
|---|---|
| Manufacturer's Part Number | HD64F2370RVLP34DV |
| Description | Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 145; Package Code: FBGA; Package Shape: SQUARE; |
| Datasheet | HD64F2370RVLP34DV Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Sub-Category: | Microcontrollers |
| Surface Mount: | YES |
| Maximum Supply Current: | 60 mA |
| No. of Terminals: | 145 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B145 |
| Package Shape: | SQUARE |
| ROM Words: | 262144 |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | FBGA |
| Speed: | 34 rpm |
| RAM Bytes: | 16384 |
| Bit Size: | 16 |
| Minimum Operating Temperature: | -40 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA145,13X13,25 |
| ROM Programmability: | FLASH |
| Terminal Pitch: | .635 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 3.3 |
| CPU Family: | H8S/2000 |
