Renesas Electronics - HD64F2372VLP34V

HD64F2372VLP34V by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number HD64F2372VLP34V
Description Microcontrollers; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 145; Package Code: FBGA; Package Shape: SQUARE;
Datasheet HD64F2372VLP34V Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 60 mA
No. of Terminals: 145
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B145
Package Shape: SQUARE
ROM Words: 262144
Terminal Form: BALL
Maximum Operating Temperature: 70 Cel
Package Code: FBGA
Speed: 34 rpm
RAM Bytes: 32768
Bit Size: 16
Minimum Operating Temperature: -20 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA145,13X13,25
ROM Programmability: FLASH
Terminal Pitch: .635 mm
Temperature Grade: COMMERCIAL
Power Supplies (V): 3.3
CPU Family: H8S/2000
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