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Manufacturer | Renesas Electronics |
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Manufacturer's Part Number | HD64F7058BP80K |
Description | Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | HD64F7058BP80K Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Sub-Category: | Microcontrollers |
Surface Mount: | YES |
Maximum Supply Current: | 150 mA |
No. of Terminals: | 272 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B272 |
Package Shape: | SQUARE |
ROM Words: | 1048576 |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | BGA |
Speed: | 80 rpm |
RAM Bytes: | 49152 |
Bit Size: | 32 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA272,20X20,40 |
ROM Programmability: | FLASH |
Terminal Pitch: | 1 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 3.3,5 |
CPU Family: | SH7000 |