Renesas Electronics - HD64F7058BP80K

HD64F7058BP80K by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number HD64F7058BP80K
Description Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE;
Datasheet HD64F7058BP80K Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 150 mA
No. of Terminals: 272
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B272
Package Shape: SQUARE
ROM Words: 1048576
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Speed: 80 rpm
RAM Bytes: 49152
Bit Size: 32
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA272,20X20,40
ROM Programmability: FLASH
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3.3,5
CPU Family: SH7000
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