Renesas Electronics - HD74LV1GW16ACME

HD74LV1GW16ACME by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number HD74LV1GW16ACME
Description BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
Datasheet HD74LV1GW16ACME Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Schmitt Trigger: NO
Maximum Seated Height: 1.1 mm
No. of Inputs: 1
Minimum Supply Voltage (Vsup): 1.65 V
Sub-Category: Gate
Surface Mount: YES
Terminal Finish: TIN BISMUTH
No. of Terminals: 6
Maximum I (ol): 6 Amp
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology: CMOS
JESD-30 Code: R-PDSO-G6
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: TSSOP
Propagation Delay At Nominal Supply: 12 ns
Width: 1.25 mm
Packing Method: TR
Load Capacitance (CL): 50 pF
Logic IC Type: BUFFER
JESD-609 Code: e6
Minimum Operating Temperature: -40 Cel
No. of Functions: 2
Qualification: Not Qualified
Package Equivalence Code: TSSOP6,.08
Length: 2 mm
Propagation Delay (tpd): 33 ns
Nominal Supply Voltage / Vsup (V): 1.8
Family: LV/LV-A/LVX/H
Terminal Pitch: .65 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 5.5 V
Power Supplies (V): 3.3
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