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Manufacturer | Renesas Electronics |
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Manufacturer's Part Number | HJ93D2010 |
Description | MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 273; Package Code: FBGA; Package Shape: RECTANGULAR; Terminal Pitch: .8 mm; |
Datasheet | HJ93D2010 Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Nominal Supply Voltage: | 1.9 V |
Maximum Seated Height: | 1.9 mm |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
JESD-609 Code: | e1 |
No. of Terminals: | 273 |
Qualification: | Not Qualified |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Length: | 19 mm |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B273 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Additional Features: | IT REQUIRES 1.8V SUPPLY FOR 100 MHZ MODELS |
Package Code: | FBGA |
Width: | 13 mm |
Terminal Pitch: | .8 mm |