HM5-8808-9+ by Renesas Electronics | Memory ICs

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Manufacturer	Renesas Electronics
Manufacturer's Part Number	HM5-8808-9+
Description	SRAM MODULE; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-XDIP-T28;
Datasheet	HM5-8808-9+ Datasheet

NAME	DESCRIPTION
Package Body Material:	CERAMIC
Maximum Standby Current:	.0004 Amp
Organization:	8KX8
Output Characteristics:	3-STATE
Sub-Category:	SRAMs
Surface Mount:	NO
Maximum Supply Current:	98 mA
Terminal Finish:	Tin/Lead (Sn/Pb)
No. of Terminals:	28
No. of Words:	8192 words
Terminal Position:	DUAL
Package Style (Meter):	IN-LINE
Technology:	CMOS
JESD-30 Code:	R-XDIP-T28
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Operating Mode:	ASYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	DIP
Input/Output Type:	COMMON
Memory Density:	65536 bit
Minimum Standby Voltage:	2 V
Memory IC Type:	SRAM MODULE
JESD-609 Code:	e0
Minimum Operating Temperature:	-40 Cel
Memory Width:	8
Package Equivalence Code:	DIP28,.6
Maximum Access Time:	150 ns
No. of Words Code:	8K
Nominal Supply Voltage / Vsup (V):	5
Parallel or Serial:	PARALLEL
Terminal Pitch:	2.54 mm
Temperature Grade:	INDUSTRIAL
Power Supplies (V):	5

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