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Manufacturer | Renesas Electronics |
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Manufacturer's Part Number | HM5-8808AB-9+ |
Description | SRAM MODULE; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Pitch: 2.54 mm; |
Datasheet | HM5-8808AB-9+ Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | CERAMIC |
Maximum Standby Current: | .000125 Amp |
Organization: | 8KX8 |
Output Characteristics: | 3-STATE |
Sub-Category: | SRAMs |
Surface Mount: | NO |
Maximum Supply Current: | 107 mA |
No. of Terminals: | 28 |
No. of Words: | 8192 words |
Terminal Position: | DUAL |
Package Style (Meter): | IN-LINE |
Technology: | CMOS |
JESD-30 Code: | R-XDIP-T28 |
Package Shape: | RECTANGULAR |
Terminal Form: | THROUGH-HOLE |
Operating Mode: | ASYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Package Code: | DIP |
Input/Output Type: | COMMON |
Memory Density: | 65536 bit |
Minimum Standby Voltage: | 2 V |
Memory IC Type: | SRAM MODULE |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 8 |
Package Equivalence Code: | DIP28,.6 |
Maximum Access Time: | 120 ns |
No. of Words Code: | 8K |
Nominal Supply Voltage / Vsup (V): | 5 |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | 2.54 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 5 |