Renesas Electronics - HM64YGB36100BP-33

HM64YGB36100BP-33 by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number HM64YGB36100BP-33
Description LATE-WRITE SRAM; Temperature Grade: OTHER; No. of Terminals: 119; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Access Time: 1.6 ns;
Datasheet HM64YGB36100BP-33 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .15 Amp
Organization: 1MX36
Output Characteristics: 3-STATE
Maximum Seated Height: 2.18 mm
Minimum Supply Voltage (Vsup): 2.38 V
Sub-Category: SRAMs
Surface Mount: YES
Maximum Supply Current: 550 mA
Terminal Finish: TIN LEAD
No. of Terminals: 119
Maximum Clock Frequency (fCLK): 300 MHz
No. of Words: 1048576 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B119
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Width: 14 mm
Input/Output Type: COMMON
Memory Density: 37748736 bit
Minimum Standby Voltage: 2.38 V
Memory IC Type: LATE-WRITE SRAM
JESD-609 Code: e0
Minimum Operating Temperature: 0 Cel
Memory Width: 36
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: BGA119,7X17,50
Length: 22 mm
Maximum Access Time: 1.6 ns
No. of Words Code: 1M
Nominal Supply Voltage / Vsup (V): 2.5
Peak Reflow Temperature (C): 240
Parallel or Serial: PARALLEL
Terminal Pitch: 1.27 mm
Temperature Grade: OTHER
Maximum Supply Voltage (Vsup): 2.63 V
Power Supplies (V): 1.5,2.5
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