Renesas Electronics - HM66WP18100BP-40

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HM66WP18100BP-40 by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number HM66WP18100BP-40
Description ZBT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 119; Package Code: BGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;
Datasheet HM66WP18100BP-40 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 1MX18
Maximum Seated Height: 2.35 mm
Minimum Supply Voltage (Vsup): 2.375 V
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 119
No. of Words: 1048576 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B119
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Width: 14 mm
Memory Density: 18874368 bit
Memory IC Type: ZBT SRAM
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Memory Width: 18
No. of Functions: 1
Qualification: Not Qualified
Length: 22 mm
Maximum Access Time: 2.6 ns
No. of Words Code: 1M
Nominal Supply Voltage / Vsup (V): 2.5
Additional Features: PIPELINED ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY
Parallel or Serial: PARALLEL
Terminal Pitch: 1.27 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 2.625 V
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