HM67B3632FP1-11 by Renesas Electronics | Memory ICs

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Manufacturer	Renesas Electronics
Manufacturer's Part Number	HM67B3632FP1-11
Description	CACHE SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: QFP; Package Shape: RECTANGULAR; Package Style (Meter): FLATPACK;
Datasheet	HM67B3632FP1-11 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	32KX36
Maximum Seated Height:	3.05 mm
Minimum Supply Voltage (Vsup):	3.135 V
Surface Mount:	YES
No. of Terminals:	100
No. of Words:	32768 words
Terminal Position:	QUAD
Package Style (Meter):	FLATPACK
Technology:	MOS
JESD-30 Code:	R-PQFP-G100
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	QFP
Width:	14 mm
Memory Density:	1179648 bit
Memory IC Type:	CACHE SRAM
Minimum Operating Temperature:	0 Cel
Memory Width:	36
No. of Functions:	1
Qualification:	Not Qualified
Length:	20 mm
Maximum Access Time:	11 ns
No. of Words Code:	32K
Nominal Supply Voltage / Vsup (V):	3.3
Additional Features:	BURST COUNTER; SELF TIMED WRITE CYCLE
Parallel or Serial:	PARALLEL
Terminal Pitch:	.65 mm
Temperature Grade:	COMMERCIAL
Maximum Supply Voltage (Vsup):	3.465 V

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