Renesas Electronics - HN29V256A0BBP-30

HN29V256A0BBP-30 by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number HN29V256A0BBP-30
Description FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 95; Package Code: TFBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
Datasheet HN29V256A0BBP-30 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 16MX16
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 1.2 mm
Programming Voltage (V): 2.7
Minimum Supply Voltage (Vsup): 2.7 V
Surface Mount: YES
No. of Terminals: 95
No. of Words: 16777216 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B95
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: TFBGA
Width: 10 mm
Memory Density: 268435456 bit
Memory IC Type: FLASH
Minimum Operating Temperature: 0 Cel
Memory Width: 16
No. of Functions: 1
Type: AND TYPE
Qualification: Not Qualified
Length: 11.5 mm
Maximum Access Time: 35 ns
No. of Words Code: 16M
Nominal Supply Voltage / Vsup (V): 3.3
Peak Reflow Temperature (C): NOT SPECIFIED
Parallel or Serial: PARALLEL
Terminal Pitch: .8 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 3.6 V
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