Renesas Electronics - HN58X2508TIE

HN58X2508TIE by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number HN58X2508TIE
Description EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Pitch: .65 mm;
Datasheet HN58X2508TIE Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 1KX8
Maximum Seated Height: 1.1 mm
Minimum Supply Voltage (Vsup): 1.8 V
Surface Mount: YES
Maximum Write Cycle Time (tWC): 8 ms
No. of Terminals: 8
Maximum Clock Frequency (fCLK): 3 MHz
No. of Words: 1024 words
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology: CMOS
JESD-30 Code: R-PDSO-G8
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: TSSOP
Width: 3 mm
Serial Bus Type: SPI
Memory Density: 8192 bit
Memory IC Type: EEPROM
Minimum Operating Temperature: -40 Cel
Memory Width: 8
No. of Functions: 1
Qualification: Not Qualified
Length: 4.4 mm
No. of Words Code: 1K
Nominal Supply Voltage / Vsup (V): 2.5
Parallel or Serial: SERIAL
Terminal Pitch: .65 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 5.5 V
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