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| Manufacturer | Renesas Electronics |
|---|---|
| Manufacturer's Part Number | HPL1-82C139-9+ |
| Description | Other Logic ICs; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; |
| Datasheet | HPL1-82C139-9+ Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | CERAMIC |
| Sub-Category: | Other Logic ICs |
| Surface Mount: | NO |
| Minimum Operating Temperature: | -40 Cel |
| No. of Terminals: | 16 |
| Package Equivalence Code: | DIP16,.3 |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| Technology: | CMOS |
| JESD-30 Code: | R-XDIP-T16 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Nominal Supply Voltage / Vsup (V): | 5 |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | DIP |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 5 |
