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| Manufacturer | Renesas Electronics |
|---|---|
| Manufacturer's Part Number | MC-22003F1-DB1-B10 |
| Description | MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 48; Package Code: BGA; Terminal Finish: Tin/Lead (Sn/Pb); Terminal Position: BOTTOM; |
| Datasheet | MC-22003F1-DB1-B10 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .000002 Amp |
| Mixed Memory Type: | FLASH+SRAM |
| Sub-Category: | Other Memory ICs |
| Surface Mount: | YES |
| Maximum Supply Current: | 70 mA |
| Memory IC Type: | MEMORY CIRCUIT |
| Terminal Finish: | Tin/Lead (Sn/Pb) |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -20 Cel |
| No. of Terminals: | 48 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA48(UNSPEC) |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | HYBRID |
| Maximum Access Time: | 100 ns |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | BGA |
| Temperature Grade: | OTHER |
| Power Supplies (V): | 3/3.3 |
